Numerical simulation and experimental investigation on heat …
2024年8月1日 · In this study, a high TC diamond/copper rectangular MCHS was designed and prepared by numerical simulation and using vacuum hot press sintering method. This method is low-cost and capable of preparing microchannel heat …
Flow boiling in a relatively large copper heat sink comprised of …
Flow boiling heat sink with high heat dissipation capability, compared to single phase heat sink, is able to meet the demanding need of cooling of high power electronics with relatively large size. For example, the rapid development of electric vehicles has dramatically boosted the power density of inverter modules to a new level.
The materials under investigation for the heat sink are aluminum and copper. Aluminum exhibits high specific weight heat capacity and low density. On the other hand, its thermal conductivity is lower than that of copper. Table I demonstrates the relevant material characteristics of …
Energy Storage or Copper Heat Sinks? A transient thermal analysis is performed to investigate thermal control of power semi-conductors using phase change materials, and to compare the performance of this ap-proach to that of copper heat sinks. Both the melting of …
Experimental and parametric numerical investigation of finned heat ...
2023年8月15日 · In this study a PCM-based heat sink with a generic structure of plate fins was investigated experimentally and numerically. The intentionally simple fin topology allowed focusing on the effects of various material properties rather …
Effect of Porous Medium and Copper Heat Sink on Cooling of Heat ...
2020年5月17日 · In this article, the transient free convection of a temperature-dependent viscosity liquid inside the porous cavity with copper radiator and the heat-generating element is studied using...
Flow boiling in a relatively large copper heat sink comprised of …
Flow boiling in copper microchannel heat sink is widely used for the cooling of high power electronic modules, particularly the IGBT power electronic modules with large sizes. However, it is challenging to significantly enhance the flow boiling performance of copper microchannel heat sink due to the long-lasting issue of vapor backflow …
Comprehensive study of postprocessed copper heat sinks on smart power …
Cu heat sinks have been postprocessed on top of smart power devices. The thermal SOA improvement was quantified by EC characterization. A measured 25% improvement in EC at 1 ms, for realistic heat sink design, demonstrates the feasibility of driver area reduction by the same amount for EC critical applications.
High-efficiency cooling via the monolithic integration of copper …
2022年5月2日 · Here we report co-designed electronic systems that monolithically integrate copper directly on electronic devices for heat spreading and temperature stabilization. The approach first coats the...
Microembossed copper microchannel heat sink for …
2019年10月23日 · A microembossed copper microchannel heat sink was designed and fabricated for high-density cooling in electronics. The microchannel width and aspect ratio were investigated to find out the optimised channel size for microembossing.