The Government is introducing an initiative called the extended producer responsibility (EPR) scheme from April, which will ...

ACM Research, Inc. (“ACM” or “ACM Research”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for ...

Nova’s performance this year and its forward-looking strategic moves make it one of the standout stocks in the semiconductor sector. Whether you’re a current investor or considering entering the ...

The Korea Institute of Machinery and Materials (KIMM), an institute under the jurisdiction of the Ministry of Science and ICT ...

The global glue machine market is poised for remarkable growth, with a projected compound annual growth rate (CAGR) of 6% through 2032. Valued at USD 1.18 billion in 2023, the market is anticipated to ...

Nova (Nasdaq: NVMI) announced today that it has entered into a definitive agreement to acquire Sentronics Metrology GmbH, a privately held company headquartered in Mannheim Germany, in an all-cash ...

The global 3D semiconductor packaging market size is expected to surge from USD 14.80 billion in 2025 to USD 57.19 billion by 2034, a study published by Towards Packaging a sister firm of Precedence ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Learn about advanced substrates and what they mean to the semiconductor industry, particularly to advanced packaging.

The U.S. Department of Commerce has entered negotiations to invest up to $300 million in advanced packaging research projects ...

Finally, Arizona State University is developing a next generation of microelectronics packaging through fan-out-wafer-level-processing (FOWLP). At the heart of this initiative is the Advanced ...