Reliability of Next-Generation Thermal Management Systems for High-Power Naval Electronics Legacy ‘remote cooling’ thermal management architectures restrict the removal of heat through a ...
Electronic devices have become smaller and more efficient while energy density has increased. How are manufacturers ...
Thermal compounds and thermal interface materials ... Thermally conductive resins, tapes, adhesives, greases, and compounds are often used between a heat-generating electrical device and a heat sink ...
After measuring the three chips with his digital calipers he cut out the footprint he needed, resulting in three smaller heat sinks. We didn’t realize that thermal compound has enough gripping ...
ToffeeX, Imperial College London, and University of Wolverhampton advance thermal management with copper 3D printing and multiscale modeling.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback