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design-engineering.com
13 天
Aluminum diffusion bonding offers speed, improved process control
Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics and energy industries ...
AZoNano on MSN
11 天
GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and ...
Graphene Manufacturing Group Ltd. ("GMG") is pleased to provide a business update on the commercialization progress of ...
10 天
Pin Fin Heat Sink Market Trends: Meeting The Rising Demand For Advanced IGBT Cooling Solutions
Global Pin Fin Heat Sink for IGBT Market Expected to Reach $1,084.3 Million by 2025 ...
ien
14 天
Getting Rid of the Heat
During the production process, the glass used for windshields is subjected to temperatures as high as 400 °C in the gravity ...
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