a pioneer in acoustic system-on-chip solutions, and X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, today announced a strategic supplier ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

The GC50B2 is a 50-Mega-pixel CMOS image sensor with a pixel size of 1μm and an optical size of 1/1.56 ... This sensor supports 60FPS 4K video shooting and is suitable for mid-to-high-end smartphone ...

Semiconductor company Infineon (IFNNY) unveiled its new silicon power wafer this week that it says is the “world’s thinnest.” The new silicon wafers, which were developed for AI data centers ...

This reduces both IP and base-chip wafer costs per user. We prototyped wafers using a 0.18- $\mu$ m CMOS process and tested the proposed structured ASIC platform and manufacturing process using ...

Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the ...

See how telescopes capture the cosmos. ExtremeTech explains the science behind lenses and space exploration. Start exploring ...

Notably, beyond AWS, Intel added two 18A wafer design wins during the quarter from compute centric companies. Intel expects its first external customer to launch their 18A design in the first half ...

Infineon unveiled an ultrathin silicon power wafer. Thinning wafers to 20µm cuts substrate resistance in half and reduces ... to develop a method for growing defect-free III–V semiconductor layers on ...