he’s showing you how to design a 3D-printed frame using Blender and TinkerCAD, making your solder paste print well even if you’re trying to rest a giant stencil on top of a tiny board.
A recent article in Scientific Reports explored methods to optimize the preparation of atom probe tomography (APT) specimens for low-melting solder materials (96.5 wt.% Sn–3.0 wt.% Ag–0.5 wt.% Cu ...
I'm test engineer, I have discussed with process engineer to improve solder wetting on drain pins of power MosFet according mfg pn: CSD17322Q5A. This device has thermal plate of drain pin. when it ...
The Thermoplastic Nylon-Based Continuous Glass Fiber Composite Material Technology, developed by the CAS Institute of Chemistry, has been applied to solar frames, which successfully passed the ...
We (Murata Manufacturing Co., Ltd.) know that the solderbility of exposed Cu (frame cut surface) on the side surface of PKG decreases due to oxidation. Dear Ti, we will use TLV74133PDQNR, ...