Infineon has unveiled the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometres and a diameter of 300 millimetres, in a high-scale semiconductor fab. The ultra-thin ...

Global silicon wafer shipments showed positive growth in both sequential and annual comparisons for the third quarter of 2024 ...

Worldwide silicon wafer shipments increased 5.9% quarter-over-quarter to 3,214 million square inches (MSI) in the third quarter of 2024.

Private equity firm ZMC has announced via press release that it has acquired a controlling stake in Pure Wafer, the largest ...

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...

An international research team in China has used Czochralski n-type c-Si wafers from China-based Sichuan Yongxiang to build textured wafers with a thickness ranging from 65 μm to 55 μm.