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The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
QPT asserts that the existing attachment method is flawed because the sinter layer, which secures the die to the substrate, generally measures 30 to 60 microns in thickness, creating a thermal barrier ...
81-year-old model’s top tip for ageing well? Don’t wait to chase your dreams, big or small The cars that helped save the company Korean Fried Shrimp Recipe - The Perfect Bite Episode 3 20 hot ...