This, in turn, necessitates controllability over the etching process at the atomic-layer (angstrom) level. In addition, the likes of 3D-NAND(4) and 3D-DRAM*5structures are used for semiconductor ...

This, in turn, necessitates controllability over the etching process at the atomic-layer (angstrom) level. In addition, the likes of 3D-NAND(4) and 3D-DRAM*5structures are used for semiconductor ...

IT之家11 月 26 日消息，韩媒 The Elec 今天（11 月 26 日）发布博文，报道称三星电子在生产 3D NAND 闪存方面取得重大突破，在其中光刻工艺中大幅缩减光刻胶（PR）用量，降幅达到此前用量的一半。 IT之家援引消息源报道，此前每层涂层需要 7-8cc 的光刻胶，而三星 ...

SK Hynix has reportedly begun mass production of its 321-layer 1Tb TLC 3D NAND Flash products, posing a potential threat to Samsung Electronics' (Samsung) leading position. This development is ...

三星电子在3D NAND闪存生产领域取得了引人瞩目的技术进展。据韩媒The Elec最新报道，这家科技巨头在光刻工艺上实现了重大革新，成功将光刻胶（PR）的使用量减半。 报道指出，在以往的3D NAND闪存生产过程中，每层涂层需要消耗7至8cc的光刻胶。然而，三星电子 ...

A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral imaging and deep learning” was published by researchers at Samsung Electronics.

Future dividend payments are subject to review and approval by the Board of Directors. Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the ...

Developed a "Square Silicon Substrate" for Semiconductor Packages - 600 mm-square rectangular silicon substrate, one of the world's largest - Mitsubishi Materials Corporation ("MMC") has developed ...