Wafer-level packaging, described in this chapter, addresses these needs at the IC packaging level. Wafer-level packaging (WLP) is IC packaging formed at the wafer level on the wafer in the wafer ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and ...

Sentronics Metrology GmbH is a global provider of wafer metrology tools for backend semiconductor fabrication. The company develops flexible and modular metrology tools equipped with multiple ...

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...

Along with expanding advanced manufacturing and packaging capacities, the global wafer foundry market is expected to surpass US$270 billion by 2029. According to DIGITIMES Research, with AI/HPC ...

SHIELD USA will spur creation of a domestic ecosystem of new advanced packaging service providers — or interconnect foundries ...

The depression of electronic gadgets captivated chip makers to chase progressions in wafer-level packaging, where vacuum ...