Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at ...

The EP21TDCSMed is a two component, room temperature curing toughened epoxy adhesive featuring exceptionally low volume resistivity. This silver filled compound has a convenient non-critical one to ...

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for Nasa low outgassing specifications. It is widely used for demanding applications in the electronic, ...

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding ... [See More] Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; ...

Manufactures and custom formulates epoxy adhesives; specializing in adhesives for LED assembly and manufacturing. EPO-TEK® offers a complete line of electrically conductive, thermally conductive, ...

It does not require any mixing but does require oven curing at 250-300 °F. Most importantly, this multifaceted epoxy is a superb conductor of electricity. Its temperature resistance profile is really ...